Our total wafer fabrication clean room area of 62,000 square feet means high productivity and excellent quality for our customers—and an excellent work environment for you.
Fab 1: 150mm
• 3500 IC wafer starts per week (20-layer process)
• Ceiling-to-wall airflow
• Air turnover (north & central, 10 exchanges/minute, class 10)
• 100% ionizer coverage, CLiMET real-time particle monitor (OCA)
• Paperless in 2008, SPC control, PM scheduler
• Automatic recipe selection in 2008 (for tools with capability)
Fab 2: 200mm
• 600 wafer starts per week (20-layer process)
• Capable of 1,600 wafers/week with additional tools
• 100% ULPA, raised floor, 7.5 air exchanges/minute
• 100% ionizer coverage, CLiMET real-time particle monitor (OCA)
• Paperless in 2008, SPC control, PM scheduler
• Automatic recipe selection